000 01037cam a22002297a 4500
999 _c2637
_d2637
003 OSt
005 20200129063218.0
008 030811s2004 ii a g b 001 0 eng d
020 _a9788126532605 (pbk)
040 _cNCL
082 0 0 _a621.3815
_bMAY-F 2011 3822
100 1 _aMay, Gary S.
245 1 _aFundamentals of semiconductor fabrication /
_cby Gary S. May, Simon M. Sze.
260 _aNew Delhi :
_bWiley,
_cc2004.
300 _axiii, 305 p. :
_bill. ;
_c26 cm.
504 _aIncludes bibliographical references and index.
505 _aCONTENTS Chapter 1: Introduction Chapter 2: Crystal growth Chapter 3: Silicon oxide Chapter 4: Photo Lithography Chapter 5: Etching Chapter 6: Diffusion Chapter 7: Ion implantation Chapter 8: Film deposition Chapter 9: Process integration Chapter 10: IC manufacturing Chapter 11: Future trends and challenges
650 0 _aSemiconductors
_xDesign and construction.
650 0 _aIntegrated circuits
_xDesign and construction.
700 1 _aSze, S. M.,
_d1936-
942 _2ddc
_cBK